FR4 luso:
| Kanthu | Mfundo Zaukadaulo |
|---|---|
| Mtundu Wazinthu | FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA |
| Makulidwe a Zinthu Zakuthupi | 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005” |
| Chiwerengero cha zigawo | 1 mpaka 20 zigawo |
| Max.Kukula kwa Board | 22.00" x 28.00" |
| Mtengo wa IPC | Kalasi II, Kalasi III |
| mphete ya Annular | 5 mil/mbali kapena Kuposa (Min. Design) |
| Kumaliza Plating | Solder(HASL), Lead Free Solder(L/F HASL), ENIG (Electroless Nickel Immersion Gold), OSP, Immersion Silver, Immersion Tin, Immersion Nickel, Hard Gold, etc. |
| Kulemera kwa Copper | Kunja: Kufikira 7oz, Mkati : mpaka 4 oz. |
| Kufufuza/Kukula kwa Malo | 3/3 mil |
| Padi yaying'ono kwambiri | 12 mil |
| Mipata Yokutidwa | 0.016" |
| Kholo Laling'ono Kwambiri | 8 mil;4 mil |
| Zala Zagolide | 1 mpaka 4 Edge (30 mpaka 50 Micron Gold) |
| Mtengo wapatali wa magawo SMD | 0.080" - 0.020" - 0.010" |
| Mtundu wa Soldermask | LPI Glossy, LPI-Matte |
| Mtundu wa Soldermask | Green, Red, Blue, Black, White, Yellow, Clear |
| Mtundu wa Legend | White, Yellow, Black, Red, Blue. |
| M'lifupi Wanjira | 0.031 " |
| Kugoletsa (v-cut) | Mizere Yowongoka, Jump Scoring, CNC V-CUT. |
| Golide | HARD, SOFT, IMMERSION (mpaka 50 MICRON GOLD) |
| Fomu ya Fayilo ya Data | Gerber RS-274x yokhala ndi kabowo kotsekera. |
| Fab.Kujambula Format | Mafayilo a Gerber, DXF, DWG, PDF |
| Mbali Ration | 10:01 |
| Counter Sink / Counter Bore | Inde |
| Control Impedence | Inde |
| Kudzera Kwakhungu / Kukwiriridwa Mwanjira | Inde |
| Mask Osavuta | Inde |
| Mpweya | Inde |
MC PCB luso:
| Kanthu | Mfundo Zaukadaulo |
|---|---|
| Chiwerengero cha zigawo | Mbali imodzi, mbali ziwiri, magawo anayi a MCPCB |
| Mtundu wa mankhwala | Aluminium, Copper, Iron base MCPCB |
| Wopereka laminate | Berquist, Ventec, Polytronics, Boyu, Wazam etc. |
| Kumaliza bolodi makulidwe | 0.2-5.0mm |
| Makulidwe a mkuwa | Kutentha - 3 oz |
| Wopereka chigoba cha solder | Taiyo, Fotochem etc. |
| Mtundu wa solder mask | White, Black, Red, Blue, Yellow etc. |
| Kumaliza pamwamba | L/F HASL, OSP, ENIG, Electrolytic Silver, Immersion Tin, Silver Immersion, etc. |
| Mtundu wa autilaini yomalizidwa | Njira, kukhomerera, V-kudula |
| Kuwerama ndi kupotoza | ≤0.75% |
| Kukula kwa Min hole | 1.0 mm |
| Max.bolodi kukula | 1500mmX610mm |
| Min.bolodi kukula | 10mmX10mm |