Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Zotsika mtengo za Aluminium core laminated copper zojambulazo SinkPAD PCB

Kodi Thermoelectric Separation Substrate ndi chiyani?

Zigawo zozungulira ndi pad matenthedwe pagawo lapansi zimasiyanitsidwa, ndipo maziko otentha a zigawo zotentha amalumikizana mwachindunji ndi sing'anga yoyendetsa kutentha kuti akwaniritse bwino kwambiri matenthedwe amafuta (zero kukana kukana).Zida za gawo lapansi nthawi zambiri zimakhala gawo lapansi lachitsulo (Mkuwa).

Titumizireni imelo

Tsatanetsatane wa Zamalonda

Zambiri za PCB

Mtundu wa PCB	SinkPAD II Technology
PCB kukula	50.0 × 60.0mm
Maonekedwe	Mabwalo Ozungulira
Mtundu wa Metal	Aluminiyamu
Malizani Makulidwe	0.062 mainchesi (1.57 mm)
Direct Thermal Njira	INDE
Thermal Conductivity	240.0 W/mK
Pamwamba Pamwamba	LF HASL
Glass Transition Temp.	170 digiri Celsius
UL Yavomerezedwa	Inde
Kutsata kwa RoHS	Inde